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Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217C Melting Point, T4 Particle (200g)
Achieve strong welding joints and oxidation resistance with our premium SAC0307 alloy solder paste, ideal for precision stencil printing and a wide range of applications.
Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217C Melting Point, T4 Particle (200g)
Item #: 199991642

Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217C Melting Point, T4 Particle (200g)

Item #: 199991642

AUD 68

Price Details

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*All items will import from US

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Achieve strong welding joints and oxidation resistance with our premium SAC0307 alloy solder paste, ideal for precision stencil printing and a wide range of applications.
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What Stands Out

Lead-Free Composition
The Sn99/Ag0.3/Cu0.7 solder paste is entirely lead-free, making it safe for both users and the environment, aligning with stringent health regulations and supporting eco-friendly manufacturing practices.
Optimized Melting Point
With a melting point of 217°C, this solder paste provides excellent thermal performance, suitable for a range of electronic applications where stability and reliability are crucial during soldering processes.
Fine T4 Particles
The T4 particle size allows for precise application and better wettability, ensuring strong joint formation. This enhances overall soldering quality, reducing defects and improving product longevity in electronic assemblies.

Product Details

Shop Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217C Melting Point, T4 Particle (200g) online at a best price in Kiribati. B0FZH9LGM7

Who Should Buy?

Suitable For
  • Electronics Engineers

    Perfect for engineers designing environmentally friendly electronic circuits using lead-free solder for compliance with regulations.

  • Assembly Technicians

    Ideal for technicians performing surface mount assembly, ensuring reliable connections with strong adhesion and excellent wetting properties.

  • DIY Hobbyists

    Great choice for hobbyists working on small electronics projects, providing an easy-to-use solder paste option with good performance.

Not Suitable For
  • High Volume Production

    Not suitable for high-speed production runs, where faster solidification times and lower melting points might be preferable.

Product Description

Sn99/Ag0.3/Cu0.7 Lead-Free Solder Paste, 217C Melting Point, T4 Particle (200g)

Have any Query? Chat with us

Customer Questions & Answers

  • Question: What is the melting point of this solder paste?

    Answer: The solder paste melts at a low temperature of 217°C.
  • Question: Do I need to clean after using this solder paste?

    Answer: No, it has a no-clean flux residue that requires no post-cleaning.
  • Question: What applications can this solder paste be used for?

    Answer: It's suitable for BGA, SMT, and PCB repairs in consumer electronics.

WIVIE Solder Editorial Review

The Sn99Ag0.3Cu0.7 Lead-Free Solder Paste, marketed as SAC0307, has garnered satisfactory reviews from users, particularly those in the electronics profession like engineers and hobbyists focusing on prototyping. This product exhibits a distinctive balance of performance and affordability, making it an appealing choice for both seasoned professionals and newcomers to lead-free soldering. One of the key highlights is the smooth texture and uniform Consistency of the paste, owing to its T4 particle size, which is beneficial for precision work in stencil applications. Users have reported excellent print quality with minimal slumping, which translates to high yields during assembly. The stated melting point of 217°C has been confirmed as accurate through practical application, and the resulting solder joints are generally well-formed and aesthetically pleasing, though some may note that the shine is slightly less than that of higher silver-content alternatives such as SAC305. In terms of handling, the practical jar packaging has received mixed feedback. While it serves its purpose of maintaining the paste's quality, some users found the amount of paste in the jar to be less than expected for the declared weight of 100g, which can be a surprise for those unaccustomed to the density of solder pastes. Another advantage of this solder paste is its compatibility with a variety of PCB finishes and components, affirming its utility for mixed assembly projects. The flux's activity is deemed sufficient, ensuring good wetting properties, although users are reminded to adapt their reflow processes due to the distinct characteristics of lead-free alternatives. Overall, the WIVIE SAC0307 has established itself as a solid performer in the lead-free solder paste market, particularly valued for its specifications, cost-effectiveness, and ease of use for novice soldering practitioners. **

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Pros

  • Smooth, creamy Consistency for easy application.
  • Excellent print quality with minimal slumping.
  • Accurate melting point for effective reflow.
  • Good performance with various PCB finishes.
  • Cost-effective compared to higher silver-content pastes.

Cons

  • Jar packaging leads to an impression of less product than expected.

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“Excellent quality and original too,when ubuy send original things I will appreciate that ,I very satisfied thank you”

23 July 2026 · via Trustpilot
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